Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...
A panel of industry experts takes a sneak peek at system-level design challenges in EVs and outlines viable solutions.
Abstract: Silicon carbide (SiC) power devices offer high switching speeds and power densities but are constrained by significant parasitic inductance and limited thermal dissipation capability.
Abstract: In this article, the design and characterization of a 1200 V, 200 A rated printed circuit board (PCB) embedded silicon carbide (SiC) MOSFET half-bridge is being presented. The layout of the ...
mSAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
One key trend that will shape 2026 is embedded investing, as more companies across diverse spaces consider adding investing and trading features like microinvesting to their offerings. The work begins ...
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