@article{chen2025diffusion, title={Diffusion forcing: Next-token prediction meets full-sequence diffusion}, author={Chen, Boyuan and Mart{\'\i} Mons{\'o}, Diego and ...
Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Abstract: This work investigates a modified pressure implicit with splitting of operators (PISO) solver that employs the successive over-relaxation (SOR) iterative method for solving the discretized ...
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