Abstract: A 3D silicon photonics packaging architecture based on a Cu-metallized Si-photonics through-silicon-via (TSV) interposer has been designed and experimentally demonstrated, which achieves ...

Abstract: The present study focuses on a 3D module composed of two stacks of 8 silicon chiplets interconnected with copper Through Molding Vias and ReDistribution Layer realized in Fan-Out Wafer-Level ...

F3D (pronounced `/fɛd/`) is a fast and minimalist 3D viewer desktop application. It supports many file formats, from digital content to scientific datasets (including glTF, USD, STL, STEP, PLY, OBJ, ...

This is the official home of the Java Apereo CAS client. The client consists of a collection of Servlet filters that are suitable for most Java-based web applications. It also serves as an API ...