Exclusive-Broadcom Expects to Sell 1 Million 3D Stacked Chips by 2027

SAN JOSE, California, Feb 26 (Reuters) - Artificial intelligence chip ⁠designer ⁠Broadcom said that it expects to ⁠sell at least 1 million chips by 2027 based on its stacked design tech, an ​executive ...
IEEE

PASS: A Priority-Based Model Assignment for Intelligent Application Acceleration in Edge Cloud

Abstract: Thanks to the fine-grained resource management capabilities, serverless computing has been extended to edge cloud environments to support diverse Artificial Intelligence of Things (AIoT) ...
MIT Technology Review

Tuning into the future of collaboration

Intelligent audio and intuitive tools are transforming collaboration from connection to creativity, says Sam Sabet, chief technology officer at Shure, and Brendan Ittelson, chief ecosystem officer at ...
IEEE

Optimizing Cloud Computing Performance Through Integration of a Threshold-Based Load Balancing Algorithm With Multiple Service Broker Policies

Abstract: The triumph of cloud computing hinges upon the adept instantiation of infrastructure and the judicious utilization of available resources. Load balancing, a pivotal facet, substantiates the ...
CNX Software

$199+ M5Stack AI Pyramid Computing Box Linux AI mini PC is based on Axera AX8850 SoC

M5Stack has just launched the “AI Pyramid Computer Box” AI mini PC powered by an Axera AX8850 octa-core Cortex-A55 SoC with a 24 TOPS NPU and featuring an unusual design since it’s housed in a ...