Nvidia unveils Vera Rubin, a next-gen AI system promising 10x performance per watt, modular design, and liquid cooling to power future data centers.
Nvidia unveils Vera Rubin, a next-gen AI system promising 10x performance per watt, modular design, and liquid cooling to power future data centers.
Tecno has introduced a new modular smartphone concept at MWC 2026, highlighting an ultra-thin base design and a magnetic attachment system for expandable ...
The TECNO will showcase its modular smartphone concept at Mobile World Congress 2026. The company's "Modular Magnetic Interconnection Technology" aims to ...
AI founder Sabrina Ramonov expands her mission to teach 10 million people how to use artificial intelligence through ...
Arduino has just announced the Arduino Matter Discovery Bundle (AKX00081), an all-in-one development kit designed to help ...
AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results