Automated DIC imaging with the DM6 M microscope enhances six-inch wafer inspection, providing reproducible results and improved efficiency for defect analysis.

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

To make the top-of-the-line chips for Apple's iPhone, such as the A14, or Nvidia's A100 series AI processors, with billions of transistors, it takes a factory that costs $16 billion to build and ...