The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
May 19, 2011, 4:17 PM EDT / Source: GlobeNewswire FREMONT, Calif., May 19, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, ...
The Chinese module maker and the Australian National University utilized phosphorus diffusion gettering and another defect mitigation strategy to improve the quality of n-type wafers. The proposed ...
The new facility forms part of ICsense’s latest strategic investment programme and is intended to support growing demand for custom ASIC solutions across multiple industries. The global ASIC market is ...
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