Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...

Watch back our March 4 webinar exploring the latest in battery simulation and modelling with industry leaders COMSOL.

The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...

French scientists have developed a fully coupled opto-electro-thermal model that reportedly predicts solar cell behavior under real operating conditions in a standalone framework. They said the model ...

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.

Science X is a network of high quality websites with most complete and comprehensive daily coverage of the full sweep of science, technology, and medicine news ...

How in-house-developed and third-party general-purpose simulation tools are limited to a few expert users and aren’t easily shareable. How multiphysics simulation of subsystems can result in an ...