Intel was first to market with backside power delivery.

A smaller version of existing 16nm technology According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes… A ...

TSMC's dominance in advanced process and packaging has made it a prime target amid US manufacturing mandates. Chip customers ...

Accelerates Pathway to Ultra High-Speed 1.6Tbps Bandwidth for Build Out of the Next Generation of Cloud Computing, AI, and Hyperscale Networks SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology ...

TSMC reported record Q4 profit and raised 2026 capex guidance to $52–$56 billion as CEO C.C. Wei confirmed progress on Arizona fab expansion under its $165B U.S. plan.

Amid a persistent semiconductor shortage driven by surging demand for artificial intelligence (AI), Taiwan Semiconductor ...

The positional swap will mark a fundamental shift in the semiconductor industry, reflecting Nvidia's growing importance amid ...

The company will boost its capital expenditure, which includes big-ticket purchases such as lithography machines, to expand ...

Taiwan Semiconductor Manufacturing Company Limited powers AI chips globally as U.S. fabs ramp. Click for an updated look at ...

Vanguard International Semiconductor (VIS) has signed a licensing agreement with Taiwan Semiconductor Manufacturing Company ...

TSMC has forecast between $52-56 billion in capex spend for 2026 after posting its eighth consecutive quarter of ...

The new 224G PAM4 IP offering brings Credo’s high-performance, power-efficient SerDes technologies with fabrication on an industry-leading advanced process technology from TSMC to provide the ...