New Electronics

Siemens introduces multiphysics cockpit for 3D IC design and verification

Siemens Digital Industries Software has introduced Innovator3D IC, new software that can deliver a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets. For ...
Design-Reuse

Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity Calibre 3DStress delivers early analysis/simulation of chip/package interactions at ...
Electronic Design

Siemens Helps Understand Heat Inside 3D Chip Designs—and Out

Today, most of the big names in the semiconductor industry are racing into the era of the 3D IC, strapping heterogeneous dies directly on top of each other to improve performance without increasing ...
Semiconductor Engineering

Six 3D-IC Design Trends That Secure The AI Era

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...