Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...
LONDON--(BUSINESS WIRE)--Process Systems Enterprise (PSE), a Siemens business, today released its rebranded gPROMS Process advanced process modelling environment. Formerly known as gPROMS ...
This year will see the broad emergence of 22-nm semiconductor processes and the beginning of an era in chip design of performance scaling versus geometric scaling. At 22 nm, innovations such as ...
Discover how this powerful open-source SPICE simulator helps you analyse and validate analog, digital and mixed-signal ...
Figure 1. (click to enlarge) Part-level flow simulation. The diversity and complexity of medical devices are likely to increase with time, as will the associated design risks and manufacturing ...
Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...
The big challenge of composite design is to develop a part that will satisfy geometric tolerances and performance requirements (e.g., weight, thermal and mechanical behaviors). Today, even if sizing ...
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