Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Marcus Hoversland, a UW graduate and process engineer at HF Sinclair in Casper, interacts with UW students in an “Intro to Chemical Engineering” class. UW has received a generous investment from HF ...

At some point in our lives, we have dropped a drinking glass or knocked over a glass-blown knickknack, only to watch it hit the floor and shatter into pieces. We learn from any early age that glass is ...