Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...
ANDOVER, Mass., March 18, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (MRCY) (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today ...
Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, announced today that it is working toward the first all-digital, ultra-low-latency chip-to-chip link between quantum ...
Parsons is actively working with the DoD to conceptualize a new generation of 3D-printed MCMs building off of the success of the first generation of HERCULES, presented at IDTechEx last year. The ...
A new technical paper titled “Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs” was published by researchers at Electronics and Telecommunications Research Institute ...
FREMONT, Calif.--(BUSINESS WIRE)--OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 ...
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