SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

The mighty GPU is shaping up to be one of the most significant innovations of human technology during the last few decades. While games such as Alan Wake 2 demonstrate visual chops that can often ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...

Future AI memory chips could demand more power than entire industrial zones combined 6TB of memory in one GPU sounds amazing until you see the power draw HBM8 stacks are impressive in theory, but ...

TL;DR: SK hynix CEO Kwak Noh-Jung unveiled the "Full Stack AI Memory Creator" vision at the SK AI Summit 2025, emphasizing collaboration to overcome AI memory challenges. SK hynix aims to lead AI ...

Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry, realize its existing ...

Samsung's new codename Shinebolt HBM3e memory features 12-Hi 36GB HBM3e stacks with 12 x 24Gb memory devices placed on a logic die featuring a 1024-bit memory interface. Samsung's new 36GB HBM3e ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

A new report from a Korean news site is sending ripples through the semiconductor industry thanks to its wide-ranging implications for future technologies. The report states that memory-make SK Hynix ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...