Designing smart-battery packs requires a holistic systems approach. By evaluating the trade-offs between components, designers can develop the best battery pack for a host system. Selecting the proper ...

Qualcomm’s next flagship mobile chip is just around the corner. The company will officially unveil it this month during the Snapdragon Summit 2024 in Hawaii. A Xiaomi 15 series poster confirmed the ...

Mastering board-level insulation principles like clearance, creepage, and dielectric strength is key to preventing arcing and ...

Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. Cory Benfield discusses the evolution of ...

Makers, hobbyists and developers that enjoy building projects using electronic components may be interested in a new range of component layout boards called STEGO. Which allow you to position and ...

In space engineering, the electronic component layout has a very important impact on the centroid stability and heat dissipation of devices. However, the diversity of components, a variety of spatial ...

The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...

Utilization of additive manufacturing for gas turbine component design has been demonstrated to accelerate design cycle times, reduce development test times, provide increased test data and serve to ...