Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing ...

The long-anticipated move to 2.5D and fan-outs is raising some familiar questions about security. Will multiple chips combined in an advanced package be as secure as SoCs where everything is ...

The 2.5D glass trend sounds like stereotypical marketing jargon… how can something exist between two and three dimensional space anyway? However, the term is actually based on a real design factor, it ...

I keep reading these references to Doom 1 and other 'first generation first-person shotters' as being "2.5D" To me this somehow implies they are 3-D perspective, but not quite up to today's "true 3-D" ...